Calls for Papers
This announcement is dedicated to our current Calls for Papers – please see the complete list below. Technical Annals Journal welcomes submissions within the scope of each individual call.
For help with submissions, please contact: firstname.lastname@example.org
Transdisciplinary Multispectral Modelling and Cooperation for the Preservation of Cultural Heritage
Deadline for Submission: 1st July, 2023
First Reviews Due: 10th July, 2023
Revised Manuscript Due: 15th July, 2023
Final Decision: 20th July, 2023
Publication: 30th July, 2023 (estimated)
Sustainable Solid Waste Management
Deadline for Submission: 30th September, 2023
First Reviews Due: 15th October, 2023
Revised Manuscript Due: 30th October, 2023
Final Decision: 10th November, 2023
Publication: 30th November, 2023(estimated)
Raw Materials and Circular Economy - Technological Developments and Future Challenges
Deadline for Submission: 10th November, 2023
First Reviews Due: 30th November, 2023
Revised Manuscript Due: 15th December, 2023
Final Decision: 20th December, 2023
Publication: 10th January, 2023(estimated)
Engineering Seismology and Earthquake Engineering
Deadline for Submission: 10th February, 2024
First Reviews Due: 30th February, 2024
Revised Manuscript Due: 15th March, 2024
Final Decision: 20th March, 2024
Publication: 10th April, 2024(estimated)
We invite researchers to submit high-quality original research articles, reviews or short communications on the above research topics.
Manuscript Submission Information
All manuscripts and supplementary material should be submitted online at Technical Annals website. Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere.
Articles should adhere to the following word limits: full-length articles (4,000-8,000 words), short communications (less than 4,000 words), and reviews (up to 10,000 words). Only English-written papers will be accepted for submission. The journal's Guide for Authors on how to prepare a paper is available at Information for Authors.